J. Am. Chem. Soc. "One-Step Multicomponent Encapsulation by Compound-Fluidic Electrospray" 2008, 130, 7800. (Chemical & Engineering News, Most-Accessed Articles)
writer：Hongyan Chen, Yong Zhao,* Yanlin Song, Lei Jiang*
keywords：微膠囊，電噴霧，多空腔
source：期刊
Issue time：2010年
A new compound fluidic electrospray method can encapsulate and keep separate its multiple components in one step, a sought-after technique in pharmaceutics as wellas materials and food science.