發明/申請人：CHO YOUHO,ANAZAWA TAKANORI,KATO SHINJI
專利號/申請號：JP20040312219 20041027
授權/申請日期：2004.10.27
PROBLEM TO BE SOLVED: To provide a manufacturing method of a lamination type micro-fluid device causing no contact or remaining of an adhesive in a part to be formed into a flow channel in stacking by an adhesive at least two device forming members each of which has an opening part where a portion of the part to be formed into the flow channel is opened on the surface. ; SOLUTION: In the manufacturing method of the lamination type micro-fluid device constituted by mutually stacking at least two device forming members each of which has the opening part where a portion of the part to be formed into the flow channel is opened on the surface, the active energy beam curable adhesive is applied to a transfer support to obtain an uncured coating film, the obtained coating film is transferred to the device forming member to cure the opening part corresponding region only and the uncured coating film is then transferred to at least one of the device forming members so as to allow the open parts to communicate with each other to stack the other device forming member and the transferred uncured coating film is cured and bonded. ; COPYRIGHT: (C)2006,JPO&NCIPI