[npj Flex Electron] Highly thermally conductive carbon nanotubes pillared exfoliated graphite/polyimide composites
作者：Yongqiang Guo, Shuangshuang Wang, Kunpeng Ruan, Haitian Zhang and Junwei Gu*
關鍵字：thermally conductive
論文來源：期刊
具體來源：npj Flex Electron
發(fā)表時間：2021年
In this work, carbon nanotubes pillared grew on exfoliated graphite by microwave-assisted method is utilized as thermally conductive fillers (CPEG) in polyimide (PI) to fabricate CPEG/PI thermally conductive composites with the combining ways of “in-situ polymerization, electrospinning, lay-up & hot-pressing”. The prepared CPEG/PI composites realized the maximum thermal conductivity (λ, 1.92 W/(m·K)) at low CPEG amount (10 wt%), much higher than that of pure PI (0.28 W/(m·K)). The λ of CPEG/PI composites show almost no change after 1000 cycles of heating and cooling in the temperature of 25~100oC. The finite element analysis simulates the nano/microscale heat transfer in CPEG/PI composites to reveal the internal reason of the λ enhancement. The improved thermal conductivity model & empirical equation could better reflect the actual λ change trend of CPEG/PI composites. Actual application test shows the CPEG/PI composites could significantly reduce the operating temperature of CPU in mobile phone.
本文通過微波輔助法高效、穩(wěn)定地制備出剝離石墨（EG）表面垂直生長取向碳納米管（CNT）的3D結(jié)構導熱填料（CPEG），并借助“原位聚合-靜電紡絲-層疊模壓”法制備CPEG/PI導熱復合材料，成功實現(xiàn)了在較低CPEG導熱填料用量下CPEG/PI導熱復合材料導熱性能的快速、高效提升。當CPEG用量為10 wt%時，CPEG/PI導熱復合材料具有最佳的導熱系數(shù)（λ, 1.92 W/(m·K)），遠高于純PI的λ（0.28 W/(m·K)）。CPEG/PI導熱復合材料的λ在25~100oC溫度范圍內(nèi)循環(huán)升降溫1000次后幾乎沒有變化，表現(xiàn)出優(yōu)異的導熱性能穩(wěn)定性和環(huán)境溫度耐受性。通過有限元法從微納尺度模擬熱流的傳導過程揭示了CPEG/PI導熱復合材料具有高導熱的根本原因。基于有效介質(zhì)理論和能量守恒定律建立的導熱模型&經(jīng)驗方程具有較好的理論計算/實驗測試結(jié)果的擬合度和匹配度，更能反應CPEG/PI導熱復合材料的λ實際變化情況。將CPEG/PI導熱復合材料置于手機CPU上能顯著降低CPU工作溫度，表現(xiàn)出優(yōu)異的導/散熱功能和實際應用價值。