Rui-Han Zhang#, Xue-Tao Shi#, Lin Tang, Zheng Liu, Jun-Liang Zhang, Yong-Qiang Guo and Jun-Wei Gu*. Thermally Conductive and Insulating Epoxy Composites by Synchronously Incorporating Si-sol Functionalized Glass Fibers and Boron Nitride Fillers. Chinese Journal of Polymer Science, 2020, 38: 730-739. 2018IF=2.804.（中國科技期刊卓越行動計劃入選項目-梯隊期刊類）.
https://doi.org/10.1007/s10118-020-2391-0
Abstrac: tGlass fibers (GFs)/epoxy laminated composites always present weak interlaminar shear strength (ILSS) and low cross-plane thermal conductivity coefficient (λ⊥). In this work, silica-sol, synthesized from tetraethyl orthosilicate (TEOS) and KH-560 via sol-gel method, was employed to functionalize the surface of GFs (Si-GFs). Together with a spherical boron nitride (BNN-30), the thermally conductive BNN-30/Si-GFs/epoxy laminated composites were then fabricated. Results demonstrate that Si-sol is beneficial to the improvement of mechanical properties for epoxy laminated composites (especially for ILSS). The BNN-30/Si-GFs/epoxy laminated composites with 15 wt% BNN-30 fillers display the optimal comprehensive properties. In-plane λ(λ//) and λ⊥ reach the maximum of 2.37 and 1.07 W·m?1·K?1, 146.9% and 132.6% higher than those of Si-GFs/epoxy laminated composites (λ// = 0.96 W·m?1·K?1 and λ⊥ = 0.46 W·m?1·K?1), respectively, and also about 10.8 and 4.9 times those of pure epoxy resin (λ// = λ⊥ 0.22 W·m?1·K?1). And the heat-resistance index (THRI), dielectric constant (ε), dielectric loss (tanδ), breakdown strength (E0), surface resistivity (ρs) as well as volume resistivity (ρv) are 197.3 °C, 4.95, 0.0046, 22.3 kV·mm?1, 1.8 × 1014 Ω, and 2.1 × 1014 Ω·cm, respectively.
玻璃纖維（GFs）/環氧樹脂層壓復合材料通常存在層間剪切強度（ILSS）差和面間熱導率（λ⊥）低等缺點?；诖?，本文以正硅酸乙酯（TEOS）和γ-縮水甘油醚氧丙基三甲氧基硅烷（KH-560）合成的硅溶膠（Si-sol）改性的玻璃纖維布（Si-GFs）為增強體，球形氮化硼（BNN-30）為導熱填料，環氧樹脂為基體，采用“涂覆-鋪層-模壓”工藝分別制備Si-GFs/環氧樹脂層壓復合材料和BNN-30/Si-GFs/環氧樹脂層壓導熱復合材料。結果表明，Si-sol的引入有助于提升Si-GFs/環氧樹脂層壓復合材料的力學性能（尤其是ILSS）。當BNN-30用量為15 wt%時，BNN-30/Si-GFs/環氧樹脂層壓導熱復合材料具有最優的綜合性能。面內熱導率（λ//）和λ⊥分別為2.37 W m-1K-1和1.07 W m-1K-1，較Si-GFs/環氧樹脂層壓復合材料的λ//（0.96 W m-1K-1）和λ⊥（0.46 W m-1K-1）分別提升146.9%和132.6%，同時約為純環氧樹脂λ（λ//=λ⊥，0.22 W m-1K-1）的10.8倍和4.9倍。此時，BNN-30/Si-GFs/環氧樹脂層壓導熱復合材料的耐熱指數（THRI）、介電常數（ε）、介電損耗（tanδ）、特征擊穿強度（E0）、表面電阻率（ρs）和體積電阻率（ρv）分別為197.3oC、4.95、0.0046、22.3 kV mm-1、1.8×1014 Ω和2.1×1014 Ω·cm。
附第一作者（張睿涵）個人簡介
張睿涵，女，陜西西安人，2018級碩士研究生。2018年于廣西大學獲學士學位，同年保送至西北工業大學顧軍渭教授SFPC課題組攻讀碩士學位。主要從事增強纖維的表面改性、填充型高導熱環氧樹脂及其復合材料的性能調控和內稟機制研究。以第一作者在Chinese Journal of Polymer Science上發表學術論文1篇。參與國家自然科學基金、陜西省自然科學基礎計劃杰出青年基金項目各1項；參加國內會議1次；授權、公開國家發明專利1件。